FPT Group on Wednesday announced the establishment of its Advanced Semiconductor Testing and Packaging Plant, making it the ...

Key opportunities include the growth of high-performance computing, automotive electronics, and IoT applications 3D ...

FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...

On the morning of January 28th, FPT announced the establishment of a semiconductor chip testing and packaging factory in ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...

Semiconductor design is among the most research-intensive industries globally, requiring years of multidisciplinary R&D, deep ...

The establishment of the advanced semiconductor chip testing and packaging factory demonstrates FPT’s commitment to ...

FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing & Packaging Plant.