The explosion in data forcing chipmakers to get much more granular about where logic and memory are placed on a die, how data is partitioned and prioritized to utilize those resources, and what the ...
We take many things in the semiconductor world for granted, but what if some of the decisions made decades ago are no longer viable or optimal? We saw a small example with finFETs, where the planar ...
The "The Global Market for Low Power/High Efficiency AI Semiconductors 2026-2036" has been added to ResearchAndMarkets.com's offering. The market for low power/high efficiency AI semiconductors stands ...
Artificial intelligence presents a major challenge to conventional computing architecture. In standard models, memory storage and computing take place in different parts of the machine, and data must ...
Non-volatile memory (NVM) systems and architectures have emerged as pivotal components in modern computing, offering the combined benefits of data persistence and enhanced energy efficiency. With ...
The MarketWatch News Department was not involved in the creation of this content. SUNNYVALE, Calif., Oct. 20, 2025 (GLOBE NEWSWIRE) -- GSI Technology, Inc. (Nasdaq: GSIT), the inventor of the ...
Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...
The biggest challenge posed by AI training is in moving the massive datasets between the memory and processor.
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