ACM Research's new SPM tool enhances wafer processing efficiency and cleanliness, gaining qualification from a key Chinese semiconductor manufacturer. ACM Research, Inc. announced that its ...

SEZ Group today said it sees opportunity in single-wafer tools, as represented by Taiwanese orders for its Spin-Processors 4300. Contributing to the company’s $66 million worldwide order intake for ...

FREMONT, Calif., Sept. 23, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

KALISPELL, Mont., June 27, 2024 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...

Forge Nano’s 200 mm single-wafer, thermal atomic layer deposition (ALD) platform for compound semiconductor manufacturing to be unveiled in Taipei Tool build slots available with delivery expected in ...

Forge Nano doubles down on semiconductor market with new tool and industry-first application to capture More-than-Moore market segments TEPHRA™ ALD cluster platform designed to coat single wafers at ...

KALISPELL, Mont., May 02, 2023 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...

The following executive comment was provided by Scott Becker, vice president of product management of FSI International Inc.'s Surface Conditioning Division. Based in Minneapolis, FSI International is ...

KALISPELL, Mont., July 12, 2023 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...

Forge Nano, Inc., a leading ALD equipment provider and materials science company, today further expanded into the semiconductor market with the unveiling of its new Atomic Layer Deposition (ALD) ...