Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

On-wafer probing techniques have become indispensable in the precise characterisation of semiconductor devices operating in the microwave and terahertz regions. These techniques enable the direct ...

Continuing increases in the speed of semiconductor devices combined with higher levels of integration, on-chip wireless functions, and the usage of mixed-signal-device designs are driving new ...

Targeting use in process-development device-characterization applications, the eVue digital-imaging system from Cascade Microtech features improved viewing, navigation, and user-friendly features. The ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing.

I’ve had a fairly varied early part of my career in the semiconductors business: a series of events caused me to jump disciplines a little bit, and after one such event, I landed in the test ...

Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international ...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...

A new paradigm for semiconductor manufacturing test is coming. Unfortunately, it’s not yet completely defined, and most manufacturers still retain the traditional split between so-called front-end and ...

MicroProbe announced today that more than 1,000 Vx and Mx vertical MEMS probe cards now are deployed worldwide in copper pillar applications. Once restricted to use in high-end logic devices, the ...