Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...
Children learn to walk, speak, and think at an astonishing pace. The D-score captures this process as a one-number summary. The D-score booklets explain why we need the D-score, how we construct it, ...
Abstract: The demands on bandwidth, latency and energy efficiency are ever increasing in AI computing. Chiplets, connected by 2. 5D interconnect, promise a scalable platform to meet such needs. We ...
These sample projects showcase how to build Unity applications for HoloLens 2 or Mixed Reality headsets using the Mixed Reality OpenXR plugin. For more details on ...
Based on 2.5-Dimensional (2.5D) frequency selective surface (FSS) structures, a new miniaturized frequency selective surface structure is proposed in this work to operate as a bandreject filter in the ...
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