The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...

The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die systems more efficiently in AI data ...

Hyper3D, the platform developed by Deemos Tech, offers a suite of AI-powered generation tools that process various input types to produce 3D models for use in gaming, film, and digital media ...

The global 3D protein structure analysis market is rapidly expanding due to growing demand in drug development, personalized medicine, and biotech research. Key opportunities include advancements in ...

Krikey AI, a premier provider of explainer video software and generative AI media, today announced it has successfully completed its SOC2 Type II certification, officially validating the platform as ...

Multiple classes at Sergeant Bluff-Luton High School are working together on their entrepreneurial skills, making metal signs that the community can commission.

With the dynamic growth and ubiquity of electronic systems globally, software-defined, AI-powered, and silicon-enabled technologies are critical for today’s semiconductor industry, which is projected ...

Apple’s M5 Pro and M5 Max redefine workstation-class performance with modular design, thermal efficiency, and unmatched computational power.

SANTA CLARA, Calif. --The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center.

PROMINENT computer scientist Fei-Fei Li's World Labs raised $1 billion in a funding round as the startup accelerates its efforts to advance "spatial intelligence." The startup said on Wednesday the ...