From computers to smartphones, from smart appliances to the internet itself, the technology we use every day only exists ...

Molecular electronic devices using quantum tunneling could achieve integration densities 1,000 times greater than silicon chips by combining atomic-precision assembly with three-dimensional ...

Researchers at Stanford University and TSMC have shown that adding an ultra-thin Al 2 O 3 interlayer improves reliability and ...

Data doesn’t have to travel as far or waste as much energy when the memory and logic components are closer together.

Advance allows fibres to compute like chips or display information like transistors, paving the way for machine-wearable ...

The raise comes less than two months after Ricursive was launched by former Google LLC researchers Anna Goldie and Azalia ...

A team of Chinese researchers has become the first in the world to develop a ‘fiber chip,’ packing high-density integrated ...

A.I. chip, Maia 200, calling it “the most efficient inference system” the company has ever built. Microsoft claims the chip ...

Discover the top 3 undervalued Semiconductors & Semiconductor Equipment stocks for Friday, January 30 based on AAII’s Stock ...

A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...

Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...

Heat-sink devices and technology have many aspects, but I am hooked on basic models of varying sizes and fabrication ...