The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in ...

Littelfuse Inc. extends its K5V Series of illuminated tactile switches with the release of new K5V4 models including the gull-wing and 2.1-mm pin-in-paste (PIP) versions compatible with reflow ...

Indium Corporation will feature its high-reliability, gold (Au)-based precision die-attach preforms for critical laser and radio frequency (RF) applications, as well as 5G communications, at the IEEE ...

Shenmao PF606-P lead-free solder paste for use in "reverse hybrid" board assembly is compatible with existing SAC SMT materials and reflow processes. Offers enhanced thermal cycling (TC) and drop test ...

The NPI Awards recognise leading new products for electronics assembly in the last 12 months. An independent panel of practicing engineers selects honourees based on a variety of criteria, including ...

SHENMAO America, Inc. is proud to announce the launch of its advanced solder paste, PF606-P275. This innovative lead-free, no-clean, zero- halogen solder paste is specifically designed for fine-pitch ...

Abstract: In this article defects occurring at reflow of solder paste Sn62Pb36Ag2 in the system of vapor-phase furnace and methods of their elimination are considered. Special attention is paid to the ...

SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder paste is not just about matching ...

PicoShot NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector. Developed through a ...